发明名称 SOLID-STATE IMAGE PICKUP APPARATUS, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING THE SOLID-STATE IMAGE PICKUP APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To obtain a sufficient amount of signal by efficiently transmitting a light signal from a wiring layer to a photoelectric conversion unit. <P>SOLUTION: There is disclosed a solid-state image pickup apparatus 1, that includes a photoelectric converter 10 formed on a substrate 2; a wiring portion 40 formed above the photoelectric converter 10 and constituted of multilayer wirings 41; and an insulating portion 30, in which the multilayer wirings 41 of the wiring portion 40 are embedded, the insulating portion 30, having a refractive index larger than a silicon oxide. Also, as a material for the insulation portion, one among silicon nitride, silicon oxynitride, hafnium oxide, and tantalum oxide is used. Additionally, an electronic apparatus that uses the solid-state image pickup apparatus 1 is disclosed. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177391(A) 申请公布日期 2010.08.12
申请号 JP20090017469 申请日期 2009.01.29
申请人 SONY CORP 发明人 KIKUCHI KOJI
分类号 H01L27/14;H04N5/335;H04N5/369;H04N5/374 主分类号 H01L27/14
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