ELECTROLESS DEPOSITIONS FROM NON-AQUEOUS SOLUTIONS
摘要
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
申请公布号
WO2010080331(A2)
申请公布日期
2010.07.15
申请号
WO2009US67594
申请日期
2009.12.10
申请人
LAM RESEARCH CORPOTATION;NORKUS, EUGENIJUS;JACIAUSKIENE, JANE;DORDI, YEZDI
