摘要 |
PURPOSE: A cleaning device of HCLU for CMP is provided to remove a particle and a scratch from a wafer in CMP process by transferring ultrasonic energy to washing water through an ultrasonic generating unit arranged on a cleaning water jet nozzle. CONSTITUTION: A cleaning water jet line comprises a cleaning water nozzle. An ultrasonic generator(10) transferring ultrasonic energy is installed on the cleaning water jet line. The ultrasonic generator comprises an oscillator and a vibrator which generate a high frequency electrical signal. The vibrator generates micro-vibration to a washing solution by an electric signal of the oscillator. The ultrasonic generator is respectively separately formed on a load-cup rinse line(111) and a pedestal rinse line(121).
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