发明名称 BONDING TOOL, ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 PURPOSE: A bonding tool, an electronic component mounting device, and a method for mounting an electronic component are provided to decrease the degree of expansion in heating by installing a cooling unit between a heater distributing unit and the side of a horn. CONSTITUTION: A horn(51) transfers a supersonic vibration. An ultrasonic vibrator(52) generates the supersonic vibration. A heater distributing unit(570) is installed between one end and the other end of the horn. A joining active part(53) is heated by the heater. A first cooling unit(515) is installed between the side of the horn and the heater distributing unit. A bonding tool(5) is installed between the heat distributing unit and the other end of the horn.
申请公布号 KR20100066382(A) 申请公布日期 2010.06.17
申请号 KR20090120339 申请日期 2009.12.07
申请人 PANASONIC CORPORATION 发明人 EBIHARA HIROSHI;WATANABE KATSUHIKO;FUJITA RYO
分类号 H01L23/12 主分类号 H01L23/12
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