发明名称 Nano-imprint lithography methods
摘要 In forming a pattern on a substrate with reduced pattern error using a mold having an area smaller than an area of the substrate, a first resin pattern is formed on at least a first of a plurality of regions of an etching object layer by imprinting resin applied to the etching object layer using a first mold The etching object layer is then etched using the first resin pattern as an etching mask. A second resin pattern is formed on at least a second of the plurality of regions by imprinting resin applied to the etching object layer using a second mold. The etching object layer is again etched using the second resin pattern as an etching mask.
申请公布号 US2010140220(A1) 申请公布日期 2010.06.10
申请号 US20090654023 申请日期 2009.12.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO YOUNG TAE;LEE SUK WON;KWON SIN;SEO JUNG WOO;KIM JEONG GLL
分类号 C23F1/00 主分类号 C23F1/00
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