发明名称 Bus bar device and printed circuit board arrangement for motor vehicle, has electric connection formed between bus bar device and element on printed circuit board and provided at part of passage openings over solder
摘要 <p>The arrangement (10) has a printed circuit board (18) provided with a set of passage openings (20) with a solder (24). The solder is adhered to the printed circuit board and a bus bar device such that holding of the printed circuit board at the bus bar device is enabled by the solder. An electric connection between the bus bar device and an element on the printed circuit board is provided at a part of the passage openings over the solder. The printed circuit board is coated with a copper lining (22) in an area of the passage openings, and the bus bar device comprises bus bars (12, 16). An independent claim is also included for a motor vehicle comprising a power source and an electrical load.</p>
申请公布号 DE102008059694(A1) 申请公布日期 2010.06.02
申请号 DE20081059694 申请日期 2008.11.29
申请人 DAIMLER AG;FORD GLOBAL TECHNOLOGIES, LLC 发明人 KUGEL, MATHIAS;LEITZ, JUERGEN;SAMMER, MICHAEL
分类号 H01R4/02;H01R43/02;H05K7/02 主分类号 H01R4/02
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