| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable to act suitable pressing force against each semiconductor device without being affected by a shape dimension of each semiconductor device. Ž<P>SOLUTION: A pushing member 10 includes a pushing part 10 P capable of pushing a semiconductor device DVA in a different shape having an contour dimension in a predetermined range, and is retained by a pair of arm members 8 coupled with a pair of lever members 6 supported to a socket body part 2 in free rotation through a coupling pin 16. In case the pushing member 10 is positioned of a pushing state, both ends of the coupling pin 16 are retained by a circular arc surface part 2ST of retention walls 2SWD and 2SWB. In case the pushing member 10 to be in a waiting state, the both ends of the coupling pin 16 are separated from the circular arc surface part 2ST of the retention walls 2SWD and 2SWB. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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