HEAT DISSIPATION DEVICE

摘要

A heat dissipation device includes a heat sink, a plurality of heat pipes extending in the heat sink, a heat-conducting plate attached to the heat pipes, and a mounting member located between the heat sink and the heat-conducting plate and firmly securing the heat pipes to the heat-conducting plate. The mounting member includes a mounting base and a mounting board mounting on the mounting base. The heat pipes extending through the mounting base are received in the heat-conducting plate. The mounting board spanning the mounting base and the heat pipes press the heat pipes towards the heat-conducting plate via fasteners extending through the mounting base and screwing in the mounting board, whereby the heat pipes have an intimate contact with the heat-conducting plate.