| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin sealed semiconductor device and a method producing the resin sealed semiconductor device which prevent a lead frame and a conductive pattern from being short-circuited even if the lead frame and the conductive pattern are brought into contact with each other. SOLUTION: Since copper foil 36 is arranged in a part in which a through-hole 26 and a circuit pattern 20 are not formed, thereby a space portion is formed between the through-hole 26 and circuit pattern 20, and the lead frame 16. By this way, the lead frame 16 comes contact with the through-hole 26 and the circuit pattern 20, so as to prevent short-circuiting. Moreover, the copper foil 36 is arranged also between a backside of the circuit board 12 in which the bonding pad 32 is formed and the lead frame 16 so as to raise the rigidity of a part established by forming the bonding pad 32 and so as to improve the connection strength of the bonding pad 32 and the bonding wire 30, by preventing the escape of supersonic vibration due to ultrasonic fusion joining. COPYRIGHT: (C)2010,JPO&INPIT |
