| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve microfabrication and improvement in reliability. <P>SOLUTION: A semiconductor device 100 includes a circuit substrate 21 having an electrode terminal 22 on one principal surface, and a semiconductor element 11 having an electrode 12 on one principal surface and flip-chip mounted on the other principal surface of the circuit substrate 21, wherein the electrode terminal 22 of the circuit substrate 21 and the electrode 12 of the semiconductor element 11 are connected by: a cylindrical electrode 31 having one end connected to one of the electrode terminal 22 and electrode 12 and also having a recessed portion 32 at the other end; and a conductive member 41 disposed in the recessed portion 32 of the cylindrical electrode 31. The semiconductor device 100 is microfabricated and improved in reliability. <P>COPYRIGHT: (C)2010,JPO&INPIT |
