发明名称 CONDUCTIVE PASTE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste improving a breakdown voltage and high-temperature acceleration life of an electronic component after baking even when an electrode layer is particularly converted into a thin layer or a multi-layer. SOLUTION: This conductive paste contains a conductive powder, a metal organic compound having a cyclic structure, coexistent material particles, an organic solvent and a resin. The metal organic compound having the cyclic structure has a metal element included in a dielectric material constituting a dielectric layer as a metal element. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010087237(A) 申请公布日期 2010.04.15
申请号 JP20080254519 申请日期 2008.09.30
申请人 TDK CORP 发明人 ISHIDA KEISUKE;KOBAYASHI AKIRA;NAKANO YUKIE;TANAKA HIROBUMI;ENDO MAKOTO
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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