| 摘要 |
A device and a method for realizing reliable electrical contacts at low temperature and low pressure between conducting materials (2, 5) on for example different substrates (1, 4) are disclosed. In one aspect, a rough and brittle intermetallic layer (3) is formed on the conducting material (2) on a first substrate (1). A soft solder material layer (6) on the other substrate (4) is used for contacting the brittle, rough intermetallic layer (3) that will break. As the solder material (6) is relatively soft, contact between the broken intermetallic layer (3) and the solder material (6) can be realized over a large portion of the surface area. At that stage, a second intermetallic layer (7) is formed between the solder material (6) and the first intermetallic layer (3) realizing electrical contact. |
