| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a semiconductor device which can stack chips on a wafer to bond the chips surely and precisely without widely changing the design of an existing device, and a manufacturing method of the semiconductor device. SOLUTION: The manufacturing apparatus includes a suction collet 4 capable of reciprocating between a first position and a second position. A chip 3 is picked up by the suction collet 4 at the first position 1, and transferred to the second position 2. The chip 3 is then bonded to a wafer at the second position 2 to form the semiconductor device which is then picked up by the suction collet 4 at the second position 2, and transferred to a third position 9. COPYRIGHT: (C)2010,JPO&INPIT |
