发明名称 Miniaturized Wide-Band Baluns for RF Applications
摘要 A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.
申请公布号 US2010033290(A1) 申请公布日期 2010.02.11
申请号 US20090579307 申请日期 2009.10.14
申请人 STATS CHIPPAC, LTD. 发明人 LIU KAI;FRYE ROBERT CHARLES
分类号 H01F5/00;B05D5/12 主分类号 H01F5/00
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