发明名称 LED Package Structure and Method of Packaging the Same
摘要 An LED package structure includes a first LED chip, a second LED chip arranged on the minor light-emitting surface of the first LED chip, a conductive unit connected between the electrode areas for parallel or serially connecting the two LED chips together, and two external electric conduction units for electrically connecting both the first and second electrode areas of the first LED chip with an external circuit.
申请公布号 US2009321756(A1) 申请公布日期 2009.12.31
申请号 US20090492606 申请日期 2009.06.26
申请人 SHEN YU-NUNG 发明人 SHEN YU-NUNG
分类号 H01L25/075;H01L33/62 主分类号 H01L25/075
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