PURPOSE: A camera module is provided to bond an image sensor pad with a sensor setting unit pad by a wire, thereby miniaturizing the camera module. CONSTITUTION: One or more lenses are combined in the inside of a lens barrel(110). A housing(120) comprises an opening into which the lens barrel is inserted. A penetration hole is formed in the center of a substrate(130). A sensor mounting unit is formed in the inner circumference of the penetration hole. An image sensor(140) is supported in the upper side of the sensor mounting unit.
申请公布号
KR20090128656(A)
申请公布日期
2009.12.16
申请号
KR20080054510
申请日期
2008.06.11
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KWON, SEA MOON;KANG, HWAN JUN;PARK, MYUNG JAE;SEOK, JIN SU