发明名称 GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY AND HIGH RESIN FLOW RESISTANCE
摘要 There is provided a gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: 10 to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.
申请公布号 EP1901343(A1) 申请公布日期 2008.03.19
申请号 EP20060766496 申请日期 2006.06.08
申请人 TANAKA DENSHI KOGYO KABUSHIKI KAISHA 发明人 MAKI, KAZUNARI;NAKATA, YUJI
分类号 H01L23/49;B23K35/30;C22C5/02;H01B1/02;H01L21/60 主分类号 H01L23/49
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