| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible wiring board which can be easily manufactured without requiring complicated manufacturing processes, and which can efficiently discharge heat generated from the electronic component when an electronic component is mounted. Ž<P>SOLUTION: The flexible wiring board includes a flexible insulating substrate where an outer lead forming area and an electronic component mounting area are adjacently formed through a first bending portion formed between both the areas, and a wiring pattern is formed on one surface of the flexible insulating substrate. One end portion of the wiring pattern formed on the flexible wiring board forms an outer lead, the other end forms an inner lead, and the flexible wiring board is formed so as to be bent to a predetermined shape. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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