摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition nearly free from a fall of a resist pattern and deterioration of a profile thereof not only in usual exposure (dry exposure) but also in immersion exposure and to provide a pattern forming method using the positive photosensitive resin composition. <P>SOLUTION: The positive photosensitive resin composition contains (A) a resin which has an acid decomposition recurring unit represented by general formula (1a) and/or (1b) and whose dissolution rate in an alkali developer is increased by an action of acid and (B) a compound generating acid by irradiation with an active ray or a radiation. In general formula (1a) and (1b), Xa<SB>1</SB>denotes a hydrogen atom, an alkyl group, a hydroxymethyl group, a trifluoromethyl group, a cyano group or a halogen atom, Ry<SB>1</SB>denotes an alkyl group or a cycloalkyl group, Ra to Ri respectively independently denote a hydrogen atom, an alkyl group, a cyano group or a halogen atom. <P>COPYRIGHT: (C)2010,JPO&INPIT |