| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition giving a semiconductor device excellent in moisture resistance reliability, and the semiconductor device by using the same. <P>SOLUTION: This semiconductor-sealing epoxy resin composition is characterized by containing an epoxy resin, a curing agent, an inorganic compound containing a carbonate of a layered double hydroxide and an inorganic filler different from the above inorganic compound. Here, as the above inorganic compound, it is preferable to use an inorganic compound expressed by following general formula (1). Mg<SB>a</SB>M<SB>b</SB>(OH)<SB>2a+3b-2c</SB>(CO<SB>3</SB>)<SB>c</SB>-mH<SB>2</SB>O (1) [wherein, M is a transition metal; 4≤a≤8; 1≤b≤3; 0.5≤c≤2; and (m) is an integer of≥0]. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
