| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate attachment structure capable of stably obtaining electrically conduction from a pattern of a wiring substrate to a case body made of a high-polymer material in which a conductive member is exposed or adhered to an inner surface, and of suppressing manufacturing cost by a simple structure and being configured at low cost. Ž<P>SOLUTION: In a plate 3, when case body contacting parts 32 formed in a plate spring shape and in a cantilevered manner at both ends are inserted and held into slits 13, respectively, a substrate contacting part 31, an intermediate supporting part 33, and coupling parts 35 and 36 are housed in a housing 14. When a screw 4 is inserted along a center axis line O1 over a substrate hole 22 and a screw hole 34 from an upper surface 2b side of a wiring substrate 2, the substrate contacting part 31 of the plate 3 is contacted and held to a pattern 21 of the wiring substrate 2 by a tension load between the screw 4 and the screw hole 34. By adding a resilient force of the case body contacting part 32 to the tension load between the screw 4 and the screw hole 34 when the case body contacting part 32 operates as a plate spring, the case body contacting part 32 is pressed, contacted and fixed to the upper surface of the slit 13 of a case body 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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