发明名称 |
Polishing slurries and methods for chemical mechanical polishing |
摘要 |
Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent. Methods for polishing copper by chemical-mechanical planarization include polishing copper with low pressures using a polishing pad and a aqueous slurries including soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent, particles of MoO3 dissolved in an oxidizing agent, and particles of MoO2 dissolved in an oxidizing agent. |
申请公布号 |
US7553430(B2) |
申请公布日期 |
2009.06.30 |
申请号 |
US20060540297 |
申请日期 |
2006.09.29 |
申请人 |
CLIMAX ENGINEERED MATERIALS, LLC |
发明人 |
CHANDRA SUNIL;NIMMALA SREEHARI;BABU SURYADEVARA VIJAYAKUMAR;PATRI UDAYA B.;HEDGE SHARATH;HONG YOUNGKI |
分类号 |
C09K13/00;C09G1/02;C09K3/14;C23F3/06;H01L21/321 |
主分类号 |
C09K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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