发明名称 HEAT CONDUCTIVE RESIN COMPOSITION
摘要 <p>Disclosed is a material having insulating characteristics, excellent formability and high heat conductivity. Specifically, a board-like filler (B) of 10-300 parts per weight having a heat conductivity of 3W/m·K or more and an average grain diameter of 1-300µm, and a particulate filler (C) of 10-300 parts per weight having a heat conductivity of 3W/m·K or more and an average grain diameter of 1/10-1/200 of that of the board-like filler (B) are added to a liquid crystal polymer (A) of 100 parts per weight. The total added amount of the components (B) and (C) is 20-500 parts per weight to the liquid crystal polymer (A) of 100 parts per weight, and the adding ratio of the component (B) to the component (C) is 3:1-1:3.</p>
申请公布号 WO2009069284(A1) 申请公布日期 2009.06.04
申请号 WO2008JP03469 申请日期 2008.11.26
申请人 POLYPLASTICS CO., LTD.;MIYASHITA, TAKAYUKI;USAMI, TAKASHI;WATANABE, MIKI 发明人 MIYASHITA, TAKAYUKI;USAMI, TAKASHI;WATANABE, MIKI
分类号 C08L67/00;C08K7/00 主分类号 C08L67/00
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