COPPER ALLOY THIN FILMS, COPPER ALLOY SPUTTERING TARGETS AND FLAT PANEL DISPLAYS

摘要

A Cu alloy thin film contains Fe and P with the balance being substantially Cu, in which the contents of Fe and P satisfy all the following conditions (1) to (3), and in which Fe2P is precipitated at grain boundaries of Cu after heat treatment at 200° C. to 500° C. for 1 to 120 minutes: <?in-line-formulae description="In-line Formulae" end="lead"?>1.4NFe+8NP<1.3 (1)<?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>NFe+48NP>1.0 (2)<?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>12NFe+NP>0.5 (3)<?in-line-formulae description="In-line Formulae" end="tail"?> wherein NFe represents the content of Fe (atomic percent); and NP represents the content of P (atomic percent).