| 摘要 |
PROBLEM TO BE SOLVED: To make higher lamination possible, suppress defects including crack, reduce short-circuit failures, and improve reliability by forming an inside electrode and a dielectric layer to be thin and uniform in the processes of forming and transferring the inside electrode and the dielectric layer of an electronic component such as a laminated ceramic capacitor. SOLUTION: A fine and highly precise electrode pattern and the thin dielectric layer can be formed in a relatively easy manner by using a heat transfer technique with thermal heads. Transfer is performed by using at least two thermal heads. COPYRIGHT: (C)2009,JPO&INPIT
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