| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. <P>SOLUTION: Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive devices are capable of providing simplified mounting on and simultaneous connection to selected electrical pathways on a printed circuit board or other mounting substrate. Shaped, plated side filter devices 100 have plates sides which provide both mounting and grounding/power coupling functions. Thin film filters may be constructed on silicon wafers 110, which are then diced from the top surface to produce a groove. The groove may be v-shaped or other shape, and is then plated with a conductive material. Individual pieces are separated by grinding the backside of the wafer down to where the grooves are intercepted. The plated grooves serve as ground or power connection points for the filter circuit. The slopes of the plated grooves are used in securing the individual pieces to a mounting surface, by soldering or using conductive epoxy. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
