| 摘要 |
A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.
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