发明名称 |
MOLDING EQUIPMENT AND INJECTION MOLDING METHOD USING THE SAME |
摘要 |
A mold apparatus is provided to manufacture a case like portable electronic instrument etc easily by installing a plurality of lower mold cores movably to a horizontal direction. A mold apparatus includes the followings: a plurality of lower mold cores(121,123) arranged according to one-way; a plurality of upper mold cores(131,133) arranged according to a direction in which the lower mold cores are arranged; core bases(102,103) including lower mold cores are installed on a mold stand movably to a horizontal direction; a driving unit installed on the mold stand and moving the lower mold cores.
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申请公布号 |
KR20090024950(A) |
申请公布日期 |
2009.03.10 |
申请号 |
KR20070089946 |
申请日期 |
2007.09.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOE, ICK SUNG;KIM, YOUNG KI |
分类号 |
B29C45/16;B29C45/26 |
主分类号 |
B29C45/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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