发明名称 MOLDING EQUIPMENT AND INJECTION MOLDING METHOD USING THE SAME
摘要 A mold apparatus is provided to manufacture a case like portable electronic instrument etc easily by installing a plurality of lower mold cores movably to a horizontal direction. A mold apparatus includes the followings: a plurality of lower mold cores(121,123) arranged according to one-way; a plurality of upper mold cores(131,133) arranged according to a direction in which the lower mold cores are arranged; core bases(102,103) including lower mold cores are installed on a mold stand movably to a horizontal direction; a driving unit installed on the mold stand and moving the lower mold cores.
申请公布号 KR20090024950(A) 申请公布日期 2009.03.10
申请号 KR20070089946 申请日期 2007.09.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOE, ICK SUNG;KIM, YOUNG KI
分类号 B29C45/16;B29C45/26 主分类号 B29C45/16
代理机构 代理人
主权项
地址