| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of preparing chemical mechanical polishing aqueous dispersion capable of preventing a surface defect such as dishing, erosion, scratch or fang in a planarization process of a polishing object surface by chemical mechanical polishing, and to provide a chemical mechanical polishing aqueous dispersion preparing set excelling in long-term preservation stability, even in a condensed state. SOLUTION: This chemical mechanical polishing aqueous dispersion preparing set includes a first composition which includes colloidal silica, having an average primary particle diameter of 15-40 nm and a basic compound and has a pH of 8.0-11.0; and a second composition which includes poly(meth)acrylic acid and an organic acid, having two or more carbonyl groups, other than the poly(meth)acrylic acid, and has a pH of 1.0-5.0. COPYRIGHT: (C)2009,JPO&INPIT |
