| 摘要 |
The method of separating the semiconductor chip is provided to prevent the damage of wafer caused by the physical impact when transferring the wafer which is progressed by the grinding process and has a thin thickness. The method of separating the semiconductor chip comprises as follows. A step is for manufacturing the semiconductor chip(100) including the circuit part in the upper side of the wafer(10). A step is for making the wafer of thin thickness by grinding the lower surface of the wafer. A step is for attaching the wafer to faces the adhesive film for the die attach to the upper side of the carrier(110). A step is for cutting the wafer along the cutting line of the wafer to include the adhesive film for the die attach formed between the semiconductor chips. A step is for separating the semiconductor chip from the carrier in the cut wafer.
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