| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high-frequency module and a wireless communication device which have superior reception sensitivity by reducing transmission signal leakage electric power while highly integrating the high-frequency module and making it compact. <P>SOLUTION: In the high-frequency module 22, one end of a parallel capacitor CG6 of an output matching circuit 26 is connected to an RF signal line 54b and the other end is connected to a second ground connection pattern 53. The second ground connection pattern is connected to only a reverse-surface ground pattern 40 of the high-frequency module through a via hole, and connected to neither an internal layer ground 55 connected to a semiconductor element 24 for power amplification nor an internal layer ground 57 connected to duplexers 4a and 4b before being connected to the reverse-surface ground pattern 40. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
