| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a film deposition method by which occurrence of a warp in a substrate can be suppressed. <P>SOLUTION: The film deposition apparatus is used for depositing a film on the substrate (25) by a vapor-phase film deposition method and characterized by being provided with a holding means (10) for holding the substrate (25) slidably in the surface direction of the substrate (25). In the film deposition apparatus, the substrate (25) is held slidably in the surface direction of the substrate (25) by the holding means (10). In this case, stress caused by the difference between thermal expansion coefficients of the substrate (25) and the film is dispersed by sliding of the substrate (25). Thereby, the warpage of the substrate (25) can be reduced. Consequently, occurrence of defects in the film can be suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
