| 摘要 |
FIELD: physics. ^ SUBSTANCE: solder paste consists of following components in given ratio, wt %: tin-lead solder 83.125 - 91.875, pine oil 2.565 - 2.835, ethyl cellosolve 1.368 - 1.512, ethyl cellulose 0.1197 - 0.1323, common resin 4.4973 - 4.9707, acetic acid 0.8645 - 0.9555, triethylamine 2.4605 - 2.7195. ^ EFFECT: optimum combination of printing and adhesive parameters with complete exclusion of process of washing obtained joints after soldering. ^ 3 tbl |
