REMOVER AND CLEANING AGENT FOR SEMICONDUCTOR ETCHING RESIDUE

摘要

PROBLEM TO BE SOLVED: To provide an aqueous and semi-aqueous composition useful for removing residue after etching and ashing from a Cu low K dielectric semiconductor devices. SOLUTION: An aqueous and semi-aqueous composition, useful for removing residue after etching and ashing from a Cu low K dielectric semiconductor devices, contains a polyprotic acid buffer system, a fluoride system, water, and an water-miscible organic solvent for an aqueous composition, and may freely contain a chelating agent, a metal corrosion inhibitor and a surfactant. COPYRIGHT: (C)2009,JPO&INPIT