| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, on thinning especially a semiconductor wafer 100, a warpage occurs in the wafer 100, when it is thinned, for example, below 100μm, and a film 101 is difficult to stick onto the wafer and individual fractions cannot be constituted. SOLUTION: A support substrate 9 is stuck, when a separation groove 8 is formed to a portion corresponding to the dicing line of the semiconductor wafer W. In this state, the backside of the semiconductor wafer W is shaved to expose the separation groove 8 and then corners are rounded by etching. COPYRIGHT: (C)2009,JPO&INPIT
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