发明名称 METHOD OF PAVING GROUND AREAS AND MULTI-LAYERED STRUCTURE MANUFACTURED BY USING THE SAME
摘要 A method of paving ground areas and a multi-layered structure manufactured by using the same are provided to prevent elasticity chips from being separated when predetermined time lapses by forming a skin layer on an elastic layer. A support layer(210) is formed on a floor surface. A primer layer(220) is formed by coating primer on the floor surface. An elasticity layer(230) is formed by coating and hardening elasticity chips and first binder resin on the primer layer. A skin layer(240) is bonded on the elastic layer by using second binder resin. The skin layer is formed by bonding a plurality of skin chips having a predetermined size on the elastic layer.
申请公布号 KR20080088049(A) 申请公布日期 2008.10.02
申请号 KR20070030394 申请日期 2007.03.28
申请人 CHOI, SUNG KAB 发明人 CHOI, SUNG KAB
分类号 E01C7/26;E01C15/00 主分类号 E01C7/26
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