| 摘要 |
<p>PURPOSE: To realize excellent structural characteristics and excellent temperature/moisture electric bias THB characteristics by including 33-39weight% silicone resin, 51-57weight% silicon dioxide, and 8-12weight% low steam pressure organic solvent selected from specific mixture. CONSTITUTION: An electronic device is inserted into a capsule 17 by a hardening material. The hardening material includes 33-39weight% silicone resin, 50-57weight% silicon dioxide, and 8-12weight% low steam pressure organic medium being polydimethylsiloxane or polymethylphenylsiloxane including a platinum catalyst and vinyl or hydride functional group. In this case, the silicon dioxide improves the resistance of capsule solvent, and contact characteristics to conductive materials 13 and 15 being copper, gold, titan or other materials. Thus, proper viscosity can be provided, satisfactory contact with metal, ceramic, and the other constituting elements of a hybrid integrated circuit can be obtained, durability can be provided, and excellent THB characteristics can be obtained.</p> |
