发明名称 APPARATUS FOR MEASURING SAMPLE THICKNESS AND SAMPLE GRINDING EQUIPMENT HAVING THE SAME AND METHOD FOR GRINDING SAMPLE
摘要 An apparatus for measuring thickness of a sample, sample grinding equipment therewith and a grinding method of the sample are provided to reduce the time for a grinding process by grinding the sample until the sample has a predetermined thickness. Sample grinding equipment with an apparatus for measuring thickness of a sample(91) includes a hole(110), a holder(100), a mount(90), a wheel(200), and a thickness measurement unit(400). The holder has the hole in center thereof and an elastic member(120). The mount is inserted in the hole, is supported by the elastic member, and mounts the sample thereon. The wheel is arranged below the mount and grinds the sample. The thickness measurement unit includes a first sensor(410), a motor(220), and a controller(440). The first sensor measures the thickness of the sample. The motor is connected to the wheel and provides the wheel with torque. The controller is electrically connected to the first sensor and the motor, determines a reference thickness of the sample, and controls the motor for realizing the reference thickness of the sample.
申请公布号 KR20080079050(A) 申请公布日期 2008.08.29
申请号 KR20070019084 申请日期 2007.02.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, BOK KYOUNG;KIM, SEUNG BEOM
分类号 G01B21/08;B24B1/00 主分类号 G01B21/08
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