发明名称 HIGH BULK LAMINATED BOARD USING EMBOSSED PLIES AND THE METHOD OF MANUFACTURE
摘要 A high bulk laminated board is produced using one or more embossed plies. A method of producing the laminated board comprises: embossing first and second plies to produce first embossed projections extending from first sides of the first and second plies; placing adhesive on the first embossed projections on the first side of each of the first and second embossed plies; bringing the first and second plies together such that the first embossed projections on the first and second embossed plies are aligned; applying pressure to the first side of each of the first and second embossed plies to cause the first and second embossed plies to adhere together to form a composite ply; and adhering first and second flat outer plies onto first and second sides of the composite ply. Corresponding apparatus is provided.
申请公布号 CA2714462(A1) 申请公布日期 2008.08.21
申请号 CA20082714462 申请日期 2008.02.14
申请人 BCP FLUTED PACKAGING LIMITED 发明人 ADIE, VICTOR
分类号 B32B37/20;B31F1/07;B32B23/06;B32B38/06 主分类号 B32B37/20
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