| 摘要 |
A semiconductor test socket is provided to maximize utilization of a product by satisfying the trend that an operation speed increases. Contact point parts(41) of conductive substrates(40) are exposed from upper and lower surfaces of the conductive substrates to allow terminals(11) of a semiconductor device(10) and lead terminals(21) of a test board(20) to be in contact with each other. The conductive substrates are continuously and repeatedly disposed in a facing manner in a state when slope portions(44) are connected between the contact point parts. An insulated elastic body(50) is filled at the positions where the slope portions are formed with the contact point parts of the conductive substrate exposed, in order to fix the conductive substrates. A reinforcing film(70) is attached between the contact point parts.
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