| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional module whose horizontal mounting area is less apt to increase, even if the number of devices is increased. SOLUTION: This three-dimensional module is configured, by adhering substrates 5 and 9 to the side face of a substrate 3, on which an MEMS chip 1 is mounted so that connection electrodes 4a and 4b formed on the side face of the substrate 3, and connection electrodes 7 and 11, formed on the upper faces of the substrates 5 and 9, can be arranged on substantially the same plane, and electrically connecting the connection electrode 4a and the connection electrode 7 by a jointing member 12a, and electrically connecting the connection electrode 4b and the connecting electrode 11 by a jointing member 12b. COPYRIGHT: (C)2008,JPO&INPIT
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