| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding method and a wire bonding apparatus by which several times of bonding are carried out at a second bonding point to improve the bonding strength between the second bonding point and a wire. SOLUTION: The wire bonding method includes a first step of forming a ball on the tip of the wire send out of a capillary and bonding the ball to a first bonding point A, a second step of moving the capillary to the second bonding point C and applying ultrasonic vibrations from the capillary to the second bonding point C to bond the wire thereto, and a third step of lifting and lowering the capillary to bring the capillary in contact with a third bonding point E positionally overlapping a stitch portion formed at the second step and applying ultrasonic vibrations to the third bonding point E. COPYRIGHT: (C)2008,JPO&INPIT |
