| 摘要 |
<p>PURPOSE:To provide a simple, reliable, durable detector by arranging light- emitting chips and photodetector chips with solid wiring in the form of a matrix on a substrate. CONSTITUTION:Recesses 11 for receiving light-emitting chips and recesses 12 for receiving photodetector chips are formed in the formed of a matrix in a substrate 1. A plated solid wiring 21 is formed in each recess 11, and a light- emitting chip 2 is attached faceup on the wiring. Similarly, a plated solid wiring 22 is formed in each recess 12, and a photodetector chip 2 is attached faceup on the wiring. The solid wiring is led to the rear side of the substrate through a via 25. After wire bonding, the substrate is molded with resin 27 that is opaque to visible light. This provides a low-cost device that is simple, thin and durable.</p> |
