| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method capable of freezing a liquid film on a substrate in a short time. <P>SOLUTION: A rinse liquid supply section 62 is provided with a temperature control section 623. The temperature control section 623 cools DIW at a temperature lower than a usual temperature. This temperature control section 623 cools the DIW at a temperature of≤10°C, preferably at≤5°C. In this case, the temperature control section 623 keeps the DIW at≥0°C, so that the DIW cannot be solidified. The cooled DIW supplied to a rinse liquid supply pipe 96 is discharged from the rinse liquid discharge nozzle 97 to the surface of a substrate to form a liquid film. Further, the cooled DIW is discharged from a liquid discharge nozzle 27 to the rear surface of the substrate via a liquid supply pipe 25 to form a liquid film on the rear surface. Since the rear surface has been cooled, when the cooled gas discharged to the front and rear surfaces of the substrate, the liquid film can be frozen in a short time. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
