发明名称 |
BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES |
摘要 |
A semiconductor structure includes a first substrate and a second substrate bonded over the first substrate. The first substrate includes a passivation layer formed over the first substrate. The passivation layer includes at least one first opening exposing a first bonding pad formed over the first substrate. The second substrate includes at least one second opening aligned with and facing the first opening.
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申请公布号 |
US2008122114(A1) |
申请公布日期 |
2008.05.29 |
申请号 |
US20060563490 |
申请日期 |
2006.11.27 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LU SZU WEI;LII MIRNG-JI;CHEN CHEN-SHIEN;WU HUA-SHU;TZOU JERRY |
分类号 |
H01L21/50;H01L23/52 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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