Connection arrangement for micro lead frame plastic packages

摘要

A connection arrangement for a micro lead frame plastic (MLP) package (20) is provided that includes a paddle (28) configured to be connected to a circuit board (24) and a first ground pad (26) and a second ground pad (26) each connected to the paddle (28). The first and second ground pads (26, 26) together with the paddle (28) are configured to provide continuity of ground between the circuit board (24) and a chip (40) mounted to the paddle (28).