THREE-DIMENSIONAL ELECTRONIC CIRCUIT APPARATUS

摘要

A three-dimensional electronic circuit apparatus in which first and second circuit boards are stacked through relay boards having a structure capable of shielding and furthermore miniaturizing electronic components mounted on the upper surface of the topmost board. The electronic components disposed between the first and second circuit boards (101, 102) are electrically shielded by a second electrode (2) formed on the side surface of a relay board (100) and the electronic components electrically connected to the second circuit board (102) are shielded from an electrical noise by a shield case (12) electrically connected to the second electrode (2).