| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of efficiently forming a cured film excellent in alkali developability and flame retardancy with high resolution. <P>SOLUTION: The photosensitive resin composition contains (A) a resin soluble in a dilute alkaline aqueous solution, which is a reaction product of (a) an epoxy resin represented by general formula (1), (b) an unsaturated bond-containing monocarboxylic acid and (c) a polybasic carboxylic acid anhydride, (B) a phenoxyphosphazene compound, (C) a compound having at least one ethylenically unsaturated bond, (D) a photopolymerization initiator and (E) a heat curing agent, wherein n represents an average and a number of 0-10; P and R represent H, a 1-8C alkyl group or an aryl group, P and R may be the same or different; and G represents a glycidyl group. <P>COPYRIGHT: (C)2008,JPO&INPIT |
