| 摘要 |
A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the film. The film has a number of holes through which the conductive patterns are partly exposed. A number of conductive bumps on an active surface of the IC chip face the inner surface of the film and enter corresponding holes in the non-conductive film to mechanically join and electrically couple to the conductive patterns. The disclosed COB package and a related manufacturing method allow a reduction in production cost, simplified process, better electrical connections, and improved reliability.
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