发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <p>A semiconductor device and a fabricating method thereof are provided to suppress corner rounding phenomenon of a resist pattern by forming linear patterns for gate electrodes on an active region and an isolation region. An isolation region(102) is formed in a semiconductor substrate(101), and active regions(103a,103b) are surrounded by the isolation region. A first gate electrode(105) is formed on the isolation region and the active region, and has a first region on the isolation region, in which the first region has a pattern width in a gate length direction larger than that of the first gate electrode on the active region. The first region has a part having a film thickness different from that of the first gate electrode on the active region. The first region of the first gate electrode is a gate contact region(105a) or a wiring region(105b).</p>
申请公布号 KR20080026517(A) 申请公布日期 2008.03.25
申请号 KR20070095501 申请日期 2007.09.19
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KUDO CHIAKI;OGAWA HISASHI
分类号 H01L29/78;H01L21/336;H01L21/8234 主分类号 H01L29/78
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